HENKEL BRAND

Bergquist Thermal gap pads & interface materials

The original GAP PAD® brand, now part of Henkel. Conformable thermal gap pads from 1.5 to 10.0 W/m·K, delivered by HeTone with local inventory, die-cutting support, and application engineering.

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Bergquist products
Brand Overview

Bergquist created the GAP PAD® category and has defined conformable thermal interface pads for decades. Acquired by Henkel in 2014, the portfolio spans soft silicone gap pads from 1.5 to 10.0 W/m·K, silicone-free formulations for optics and silicone-sensitive assemblies, SIL PAD® electrically insulating pads, and liquid gap fillers. Low-modulus formulations fill uneven gaps with minimal stress on fragile components while damping shock and vibration.

As an authorized Henkel channel, HeTone supplies the Bergquist range in sheets, rolls, and custom die-cut parts with local inventory in Asia. We help engineers match pad hardness, thickness (0.010 in to 0.250 in), and compression force to their gap stack-up, from prototype samples through kitted volume production.

Product Series

Featured product families.

GAP PAD® Conformable Pads

Soft, highly conformable pads that eliminate air gaps and cut interface thermal resistance. Ultra-low-modulus (ULM) grades wet out at low pressures and apply minimal stress to fragile components.

1.5 – 10.0 W/m·K

Silicone-Free Formulations

Silicone-free GAP PAD® grades such as TGP 3004SF deliver 3.0 W/m·K for optics and silicone-sensitive assemblies. Available in thicknesses from 0.010 in to 0.125 in.

Silicone-free

Formats & Die-Cut Parts

Sheets, rolls, and custom die-cut parts, adhesive-backed or naturally tacky, with optional rubber-coated fiberglass reinforcement for puncture and tear resistance. Peel-and-place handling speeds assembly.

Custom die-cut
In Depth

A closer look.

Bergquist gap pad applied on a circuit board

Fill the gap, cut the resistance

Components never sit perfectly flat. GAP PAD® materials fill the uneven space between hot components and heatsinks or housings, displacing the air that would otherwise insulate the joint. Soft, low-modulus formulations conform to tolerance stack-ups and surface roughness at low pressure, so fragile BGAs and solder joints stay unstressed while heat flows.

  • Eliminates insulating air pockets in the thermal path
  • Conforms to uneven surfaces at low compression force
  • Damps shock and vibration between assemblies
Engineer flexing a conformable thermal gap pad

Soft where it matters, tough where it counts

Ultra-low-modulus grades wet out onto surfaces at minimal pressure, yet the pads handle real production: they resist puncture, shear, and tearing, and rubber-coated fiberglass reinforcement is available for high-stress applications. Peel-and-place handling keeps assembly fast and repeatable, with no cure time and no mess.

  • ULM grades wet out at minimal assembly pressure
  • Puncture, shear, and tear resistant, reinforcement optional
  • Peel-and-place, no cure, no mess
Assorted Bergquist gap pad formats

Sheets, rolls, and die-cut parts

The portfolio spans thicknesses from 0.010 in to 0.250 in, in silicone and silicone-free formulations, the latter from 0.010 in to 0.125 in for optics and silicone-sensitive assemblies. Choose adhesive-backed or naturally tacky surfaces, and let HeTone supply exact die-cut geometries kitted for your production line.

  • Thickness range 0.010 – 0.250 in
  • Silicone-free line for optics and sensitive assemblies
  • Custom die-cut geometries, kitted for production
Key Models

Representative models we stock.

These are selected highlight SKUs, contact us for the full catalogue and custom cut sizes.

ModelTypeKey SpecApplication
GAP PAD® TGP 1500Gap Pad1.5 W/m·K, silicone-basedGeneral IC → heatsink
GAP PAD® TGP 3000ULMGap Pad, ULM3.0 W/m·K, ultra-low modulusFragile BGAs, low-stress assembly
GAP PAD® TGP 3004SFSilicone-free3.0 W/m·K, silicone-freeOptics, silicone-sensitive
GAP PAD® TGP 5000Gap Pad5.0 W/m·K, fiberglass-reinforcedConsumer electronics
GAP PAD® TGP 6000ULMGap Pad, ULM6.0 W/m·K, natural tackIGBT / power components
GAP PAD® TGP 7000ULMGap Pad, ULM7.0 W/m·K, -60 – 200 °CData center, power supplies
GAP PAD® TGP 10000ULMGap Pad, ULM10.0 W/m·K, ultra-low modulus5G, data center
Applications

Where Bergquist products are used.

Data Center Power Modules Electric Vehicles 5G Networking Electronic Materials

Need help selecting the right GAP PAD® for your gap height and compression force?

Send us your thermal requirements, we will recommend and validate the right material combination for your design.

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