THERM-A-GAP™ Pads
Soft, compressible gap pads from 1.0 to 6.0 W/m·K. Available in sheet, die-cut, and custom shapes. Ultra-low compression force protects fragile BGAs while bridging gaps from 0.5 mm to 5.0 mm.
1.0 – 6.0 W/m·KFrom THERM-A-GAP pads to fire-rated cooling hoses and non-spill quick disconnects. HeTone is the authorized distributor across Asia, providing selection support, inventory, application engineering, and in-house hose assembly.

Parker Chomerics, a division of Parker Hannifin, has led the thermal interface material (TIM) market for over four decades. Their THERM-A-GAP, CHO-THERM, and T-FLEX product families are the industry standard for moving heat from semiconductors to heatsinks in applications from consumer electronics to defence-grade systems.
As an authorized distributor, HeTone provides the full Parker Chomerics portfolio with local inventory in Taiwan, technical pre-sales support, and qualification assistance. We help engineers select the right TIM for their gap, thermal resistance, and compression-force requirements, from prototype samples through volume production.
The partnership now spans the full liquid-cooling flow path: UL94 V-0 rated thermal management hoses, non-spill quick disconnects up to blind-mate rack systems, push-in fittings, and process valves from the Parker Hose Products and Quick Coupling divisions. In Taiwan, HeTone cuts, crimps, cleans, and leak-tests hose assemblies to ISO 16232 cleanliness in a class 100K clean room, delivering ready-to-install kits for data-center and industrial cooling loops.
Soft, compressible gap pads from 1.0 to 6.0 W/m·K. Available in sheet, die-cut, and custom shapes. Ultra-low compression force protects fragile BGAs while bridging gaps from 0.5 mm to 5.0 mm.
1.0 – 6.0 W/m·KElectrically isolating thermal pads with dielectric strength up to 4 kV. Ideal for power modules, MOSFETs, and any interface where thermal transfer and electrical isolation must coexist.
Up to 4 kV isolationHighly conformable gap fillers for uneven surfaces and large gaps. Excellent wetting and surface contact without the mess of thermal grease. Reworkable and reusable.
Highly conformableFire-rated EPDM hoses for data-center liquid cooling: 801TM and 807 Push-Lok with UL94 V-0 covers, the 629 Server Blade hose for rack manifolds, and E-Z Form hoses for tight routing and large-bore facility lines.
UL94 V-0 ratedNon-spill dry-break couplings from DN 3 to DN 25 in brass, stainless, and aluminium: NSI, NSP, NSG, NSE, and CDT series, plus Intel-compatible UQD and blind-mate NSEC systems for server racks.
Non-spill, DN 3-25LF series push-in fittings including 316L stainless LF3800, hose barbs and 82 series fittings, plus stainless check valves, filter check valves, and RL4 relief valves to protect and complete the cooling loop.
316L stainless options
Parker thermal management hoses move DI water and glycol coolants through data centers safely: fire-retardant covers carry UL94 V-0 ratings, with temperature ratings from -40 C to 100 C across the family.

Dry-break quick disconnects let servers and cooling loops be serviced without spillage: ball-locking mechanisms, low pressure drop, and body and seal options that match glycols, heat-transfer oils, esters, and deionized water.

For standardized server cooling, Parker UQD and UQDB couplings interchange fully with other Intel-approved UQD suppliers, while the CDT series covers the OCP-defined LQC interface at DN 25 for rack manifolds.

Beyond hose and couplings, HeTone supplies the Parker connection hardware around them: push-in fittings up to 316L stainless for corrosive or high-purity fluids, plus check, filter-check, and relief valves for flow protection.

HeTone builds Parker hose assemblies locally: automated cutting, crimping, and clamping, ISO 16232 cleanliness processing in a class 100K clean room, and helium, nitrogen, or water leakage testing on every assembly line.
These are selected highlight SKUs, contact us for the full catalogue and custom cut sizes.
| Model | Type | Key Spec | Application |
|---|---|---|---|
| THERM-A-GAP 579 | Gap Pad | 3.5 W/m·K, ultra-soft | GPU/CPU → heatsink |
| THERM-A-GAP 580 | Gap Pad | 5.0 W/m·K, high-k | Power modules, EV |
| CHO-THERM 1671 | Insulator | 1.4 W/m·K, 4 kV | IGBT isolation |
| CHO-THERM 1674 | Insulator | 2.0 W/m·K, 3 kV | TO-247 / TO-220 |
| T-FLEX 300 | Gap Filler | 1.2 W/m·K, conformable | Consumer electronics |
| T-FLEX 600 | Gap Filler | 3.0 W/m·K, high fill | Server / telecom |
| T443 | Phase Change | Low Rth, reflow-compatible | Lid → IHS |
| 801TM Push-Lok Plus | TM Hose | UL94 V-0 cover, VW-1 | Data-center coolant lines |
Send us your thermal requirements, we will recommend and validate the right material combination for your design.