RF amplifier thermal
High-conductivity TIMs (5.0–12.0 W/m·K) that pull heat from GaN PAs and Doherty amplifiers into the heatsink under continuous RF load, maintaining gain flatness and efficiency across the operating band.
RF power-amplifier cooling and network-equipment thermal materials, interface and EMI materials for base stations and network hardware.
A 5G Massive MIMO active antenna unit (AAU) can dissipate over 1,000 W from 64 or more transceiver channels in a sealed, pole-mounted enclosure weighing under 25 kg. GaN power amplifiers push RF power densities past 10 W/mm², and junction temperatures above 200 °C at the die. The thermal interface materials must simultaneously conduct heat and suppress electromagnetic interference, all while surviving rain, wind loading, UV, and temperature swings from −40 °C to +55 °C for 10+ years without maintenance access.
HeTone supplies dual-function EMI/thermal absorbers, high-conductivity RF-amplifier TIMs, and conformal coatings from Parker Chomerics and Bergquist, engineered for the always-on reliability that telecom infrastructure demands. We validate material performance against ETSI EN 300 019 environmental classes and carrier-specific qualification requirements.
Licensed materials, the components around them, and the engineering to sign the system off.
High-conductivity TIMs (5.0–12.0 W/m·K) that pull heat from GaN PAs and Doherty amplifiers into the heatsink under continuous RF load, maintaining gain flatness and efficiency across the operating band.
Combined EMI/thermal absorbers that attenuate spurious emissions while conducting heat, plus conformal coatings that protect PCBs from salt fog, humidity, and condensation in IP65/IP67 outdoor enclosures.
Material selection validated against ETSI EN 300 019 environmental classes, Telcordia GR-487 (outdoor cabinets), and carrier-specific reliability targets, supporting 10-year field-life guarantees.
Representative materials we supply for this domain, the exact set is qualified to your design.
Tell us your application and constraints, we will qualify a material system for it.