Liquid cooling for high-TDP GPU and CPU racks, qualified fluids, components, and interface materials for immersion and direct-to-chip architectures.
AI training clusters now exceed 100 kW per rack, with next-generation GPU modules dissipating over 700 W each. At these densities, air cooling cannot maintain junction temperatures within safe limits, even with optimised airflow and high-speed fans. Direct-to-chip liquid cooling and full immersion are the only paths forward, but they only work when every material in the loop (coolant, thermal interface, seal, and connector) is qualified to run together for years without chemical drift, fouling, or leaks.
HeTone supplies and qualifies the complete material stack for liquid-cooled infrastructure: dielectric immersion fluids, glycol-based coolants, high-conductivity TIMs, and leak-proof clamp systems, drawing on licensed lines from Henkel, Parker Chomerics, Oetiker, and ExxonMobil. We test compatibility and ageing against your specific architecture so the system is signed off before it ships, not debugged after.
Licensed materials, the components around them, and the engineering to sign the system off.
Single- and two-phase dielectric fluids and glycol-based coolants matched to your loop chemistry, rated for continuous operation at inlet temperatures from 25 °C to 45 °C with less than 3 % capacity loss over five years.
Oetiker clamps, quick-disconnect fittings, and leak-detection tapes qualified for fluorinated and glycol loops, plus Parker Chomerics interface materials that hold thermal resistance below 0.05 °C·cm²/W under continuous server duty.
Compatibility screening, accelerated-ageing tests, and thermal validation against your real rack layout, so the material set is certified before deployment, not troubleshot after.
Representative materials we supply for this domain, the exact set is qualified to your design.
Tell us your application and constraints, we will qualify a material system for it.