EN
Thermal interface materials
Gap fillers (1.0–8.0 W/m·K), pads, putties, and dispensable TIMs that bridge components to shields and chassis across gaps from 0.3 mm to 5.0 mm, at compression forces low enough to protect fine-pitch BGAs.
EN
SOLUTIONS · ELECTRONIC MATERIALS
Gap fillers and encapsulants for modern electronics.
Gap fillers and encapsulants for consumer and industrial electronics, thermal and protective materials that fit dense, miniaturised assemblies.
The Challenge
Less space, more heat.
A flagship smartphone SoC dissipates 8–12 W in a chassis only 7 mm thick. A compact industrial gateway packs an edge-AI accelerator, cellular modem, and power supply into a fanless IP67 enclosure. In both cases, thermal gap fillers have to bridge irregular gaps as small as 0.3 mm at compression forces low enough not to crack BGAs, while surviving drop tests, vibration, and years of thermal cycling.
HeTone supplies a full line of ultra-soft gap fillers (as low as 5 psi deflection), EMI/thermal absorbers, dispensable TIMs, and protective encapsulants from Bergquist, Parker Chomerics, and Henkel, matched to your assembly process, gap tolerance, and form factor from prototype through high-volume production.
Key Applications
Where these materials work.
Smartphone & tablet thermal stacks (SoC, PMIC, 5G modem)
Notebook / laptop cooling (CPU, GPU, VRM)
LED driver modules & display backlight units
IoT gateways and edge-computing devices
Wearable electronics and AR/VR headsets
What We Provide
A qualified material set, not a catalogue.
Licensed materials, the components around them, and the engineering to sign the system off.
EMI & encapsulation
Combined EMI/thermal absorbers that handle interference and heat in one layer, plus conformal coatings and encapsulants that protect boards from moisture, dust, and chemical exposure in harsh environments.
Process & DFM support
Material selection, dispensing pattern design, and compression-stack analysis that fit your assembly line, from engineering samples through million-unit production with consistent thermal performance.
Relevant Materials
Drawn from our licensed portfolio.
Representative materials we supply for this domain, the exact set is qualified to your design.
Bergquist gap fillers & padsParker Chomerics EMI/thermal absorbersHenkel Loctite encapsulantsDispensable TIM (silicone & non-silicone)Conformal coatingsThermal adhesive tapes
Related Solutions
Adjacent domains we cover.
Cooling a dense electronic assembly?
Tell us your application and constraints, we will qualify a material system for it.